• Zig-zag Pattern to connect DIP IC’s and DIL headers pin-to-pin.
• Single-sided, 1oz/ft2 copper, anti-tarnish coating for easy soldering.
• Etched high-quality FR4 glass-epoxy circuit board with solder mask to prevent solder bridges.
• 31 x 38 holes, 62 separate BusBoard traces, 0.037" holes are drilled on 0.1" (2.54mm) centers.

The BusBoard-2 prototyping circuit board has the BusBoard zig-zag circuit pattern which is great for high connectivity I.C. and connector applications. The pattern connects DIL headers and DIP ICs pin-to-pin without cutting tracks or adding wires. It’s great for 2-row parts with many common signals. Opposite sides of the IC or connector are on separate tracks to simplify wiring. It's ideal for memory buses or DIL connector breakout boards. Narrow and wide tracks identify the connected pads. Indicator holes show which are the wide tracks from the top side. The solder mask helps avoid solder bridges and shorts between tracks.